BIS Innovation Hub and HKMA invite global innovators to participate in a trade finance digitisation TechChallenge

Press release | 03 August 2020TechChallenge competition to highlight potential of new technology to safeguard and enhance trade financing.Firms are invited to submit innovative solutions to address TradeTech operational challenges by 31 August 2020.Financial sponsorship will be offered to further develop the most promising responses.

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